第三代半导体（SiC、GaN 等）以禁带宽度大（3.2eV）、击穿电场高（2.2MV/cm）、热导率优异（4.5W/cm・K）等特性，成为 5G 通信、新能源汽车、国防军工等战略领域的核心支撑。然而，其高硬度、高脆性、化学稳定性强的材料特性，导致传统磨料难以实现高效率、高质量、低成本加工，成为行业规模化应用的 “卡脖子” 瓶颈。
中晶睿芯深耕半导体材料加工领域，突破性推出聚集体金刚石磨料技术，针对第三代半导体材料特性定制化开发解决方案，实现加工效率与精度的双重跃升，助力客户在先进制造赛道抢占先机。
CORE PRODUCT
核心产品
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技术领航：
破解第三代半导体加工难题
5G 通信与射频领域
GaN 射频器件加工：聚集体金刚石研磨技术实现氮化镓衬底表面粗糙度＜5nm，满足高频器件对材料表面完整性的严苛要求；
基站散热模块加工：高效研磨碳化硅热沉材料，热导率保持率达 98%，助力 5G 基站小型化与能效提升；
新能源汽车与电力电子
SiC 功率器件制造：突破碳化硅衬底精密加工瓶颈，研磨效率较传统工艺提升 50%，助力车规级芯片成本下降 30%；
电机硅钢片切割：电镀聚集体金刚石线实现硅钢片 “零毛刺” 切割，损耗降低 20%，推动扁线电机规模化应用；
国防军工与航空航天
蓝宝石窗口片抛光：固结磨料垫技术实现蓝宝石表面光泽度达 90GU（传统工艺仅 50GU），满足红外光学系统高透光率需求；
高温合金部件加工：类多晶金刚石磨料解决镍基合金粘刀难题，加工效率提升 40%，保障航空发动机关键部件精度。
Features：
Agglomerated diamond powders with multi-edge strueture and high self.sharpening characteristies are made of high-strength, high-wear-resistant, high-sharpness.high-quality diamond, produced by a special processing technology, the sharpness isoutstanding, the particle size distribution is concentrated, and the material removal abilityis strong.Usages: Agglomerated diamond powders are mainly used for
resin, metal, and ceramic-baseddiamond tools such as diamond wire, grinding wheels, and fixed abrasive pads, especially forcutting, grinding, and lapping of semiconductors such as silicon carbide, gallium nitride,sapphire,monocrystaline silicon.zireonia.and quartz.
CORE PRODUCT
核心产品
团聚金刚石破碎技术系列
特点：具备多刃口结构和高自锐特性，原料采用高强度、高耐、高锐度的优质金刚石，经过特殊加工工艺生产，锋利度好，粒度分布集中，去除材料能力强。用途:主要用于金刚线、砂轮、固结磨料垫等树脂、金属、陶瓷基具，特别适用于碳化硅、氮化镓、蓝宝石、单晶硅、氧化锆、石英等半导体的切割、精磨、精研加工。
CORE PRODUCT
核心产品
团聚金刚石球系列
特点：具备多刃口结构和高自锐特。球形表面金刚石刃口出露更为规则，去除材料稳定性高，造成损伤小。用途:主要用于固结磨料垫、研磨抛光膏、研磨抛光液等，特别适用于碳化硅、氮化镓、蓝宝石、单晶硅、氧化锆、石英等半导体的精研和粗抛加工。
应用场景
赋能战略产业升级
Features：
Agglomerated diamond powders with multi-edge strueture and high self.sharpening characteristies are made of high-strength, high-wear-resistant, high-sharpness.high-quality diamond, produced by a special processing technology, the sharpness isoutstanding, the particle size distribution is concentrated, and the material removal abilityis strong.Usages: Agglomerated diamond powders are mainly used for resin, metal, and ceramic-baseddiamond tools such as diamond wire, grinding wheels, and fixed abrasive pads, especially forcutting, grinding, and lapping of semiconductors such as silicon carbide, gallium nitride,sapphire,monocrystaline silicon.zireonia.and quartz.
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